The YSB55w from Yamaha is a high-speed & high-accuracy flip chip bonder unit. It offers a high bonding accuracy and 3 times the productivity of conventional machines! The YSB55w brings a new era in semiconductor packaging for the expanding flip chip market.

Features of YSB55w

• High bonding accuracy and x3 productivity of conventional machines!
  This brings a new era in semiconductor manufacturing packaging for the expanding flip chip market.
• High-speed 8-die simultaneous pickup & simultaneous transfer achieve 13,000 UPH
• High-accuracy: ±5μm (3σ)
• High-quality & flexibility