Flip Chip Bonder YSH20


High-speed, high-precition flipchip hybrid placer

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High-speed, high-precision flip chip hybrid placer for semiconductor back-end industry. YSH20 is a hybrid surface mounter, specially designed to mount printed circuit boards with flip chips that are used in increasing numbers today in IT communications devices and electric home appliances. Yamahas YSH20 features a high-rigidity frame and dual mount heads and is fitted with a chip recognition system employing a camera with high resolution performance. In addition to providing high levels of mounting accuracy and highest speed.


Features of YSH20

  • 4,500 UPH (0.8 sec/unit); the top mounting capability in semiconductor manufacturing flip chip bonding
  • +/- 10 µm (3σ) mounting accuracy
  • YWF wafer supply unit “6/8/12 inch”, “expand ring”, and “θ angle correction” applicable
  • 0.6 × 0.6 mm to 18 × 18 mm components applicable