Features

Reliable 3D SPI with Quality Uplink, process control and DualView

• Precise control of all essential 3D features; calibration-free
• Extremely high throughput due to FastFlow Handling
• Integrated height tracking 
• Viscom Quality Uplink: process optimization and first-pass yield increase
• Simple process analysis with the Viscom Uplink Analyzer
• Fast program generation 
• Print optimization through interlinkage with printer (closed loop)

Options

• Freely configurable interfaces to connect various modules
• Communication with MES systems
• Label printers and bad board markers control
• Intelligent FIFO buffer control
• Preparation, storage and printing of error logs
• Flexible single- and multi-line utilization of the verification and repair station
• Management monitoring through Viscom SPC
• User-friendly real image display providing a better verification
• Long Board Option for longer PCBs available