Top Features

Manual rework of BGA, QFP and sockets.

• Flexibility
  Various PCB sizes and shapes as well as components available

• Under-heating system
  IR heating system, variable heating area

• Multifunctionality
  One device for all processes, including desoldering, pad cleaning, camera-supported positioning and soldering

• Precision
  Precise camera-supported placement

• Software

  Simple, intuitive, tablet-compatible

• Plug and Play

  Compact format, innovative design and intuitive operation for professional manual rework

EXPERT 05.6 IXH

The Rework station with 2,000 W heating power in IR technology allows uniform heating over an area of 185 x 245 mm² and prevents mechanical stress due to temperature differences during the process. The high-resolution camera delivers fast, accurate and reproducible placement results. Even the smallest components from a size of 1 x 1 mm² can be repaired and placed. User-friendly handling is provided by the touch-enabled EASYSOLDER 07 software. Reflow profiles with individual temperature parameters can be created, edited and saved and enable high process reliability and repeatable soldering. The Expert 05.6 IXH is a precise, cost-effective solution for the complete rework process on one unit.

Standard equipment

• Two pens with magazine for soldering, residual solder removal and placing
• Solder nozzle 7 mm, BGA soldering tool 27 x 27 mm²
• Thermocouple sensor (Type K)
• Two PCB magnet holder 40.5mm (standard)
• PCB magnet holder rail 40.5mm
• Manual
• Intuitive software EASYSOLDER 07 with touch integration

Components

• LED rework
• Daughter boards
• Interposer boards
• Sub assemblies
• RF frames
• RF shields
• Rework on flex
• Small passives down to 0402
• SON
• PGA
• QFP
• PoP
• DFN
• QFN
• µBGA/CSP
• BGA
• Sockets
• Connectors
• CPU
• Underfiller or coated components
• Film capacitor

Processes 

• Dipping
• Paste printing
• Solder removal
• Soldering
• Desoldering
• Reballing