EXPERT 10.6 HXV

5300 W Rework station
Semiautomatic hybrid Rework station for repairing large circuit boards, such as server- or mainboards.

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Top Features

Camera-supported rework

  • Flexibility

    Various PCB sizes and shapes as well as components available up to 75 x 75 mm2

  • Under-heating system

    Large PCBs 480 x 480 mm2

  • Performance

    Uniform heat distribution through convection and hybrid technology

  • Multifunctionality

    One device for all processes, including desoldering, pad cleaning, automatic positioning and soldering

  • Process control

    Automatic profiler for under- and top-heating systems

  • Software

    Simple, intuitive, tablet-compatible

 

EXPERT 10.6 HXV

Rework Station with 5,300 W hybrid under-heating system. The heating area of 450 x 420 mm2 is adjustable to PCB size. Automated SMD placement process by Auto Vision Placer (AVP) incl. EASYSOLDER 07 software package and DBL 06 control unit with six high resolution sensors inputs for thermocouples (Type K).

This system is particularly suitable for large size PCBs like PCs, Laptops and Server Boards with small up to very big components.

 

Standard equipment

  • Tool set for dispensing, placing, residual solder removal and soldering with magazine
  • Set of placement nozzles XL-type (BGA/CSP) 5 mm, 8 mm, 15 mm with O-Ring
  • Set of solder nozzles (BGA) 15 mm, 27 mm, 35 mm, 40 mm
  • Two camera lenses (BGA und CSP)
  • Two thermocouple sensors (type K)
  • Six PCB magnet holder 40,5 mm (3x standard, 3x Easy Lock)
  • Three PCB clips to install at hand rest
  • Foot switch
  • Manual
  • Intuitive software EASYSOLDER 07 with touch integration

 

Components

  • LED rework
  • Daughter boards
  • Interposer boards
  • Sub assemblies
  • RF frames
  • RF shields
  • Rework on flex
  • Small passives down to 0402
  • SON
  • PGA
  • LGA
  • QFP
  • PoP
  • DFN
  • QFN
  • µBGA/CSP
  • BGA up to 75x75mm
  • Sockets
  • Connectors
  • CPU
  • Underfiller or coated components
  • Film capacitor

 

Processes 

  • Dipping
  • Paste printing
  • Solder removal
  • Soldering
  • Desoldering
  • Reballing
  • Dispensing
  • Multichip soldering